|Publisher:||American Society of Mechanical Engineers,U.S. (September 15, 2001)|
|Category:||Engineering and Transport|
|Other formats:||azw lrf txt mbr|
This requires accurate experimental data to be used for benchmarking.
This requires accurate experimental data to be used for benchmarking. Some attempts have been made as evidenced in Chang et al.
1994, "Spray Cooling for the 3D Cube Computer", IEEE Proceedings of the Intersociety Conference On Thermal Phenomena. REFERENCES Patel, . 2000 Enabling Pumped Liquid Loop Cooling: Justification and the Key Technology and Cost Barriers, International Conference and Exhibition on High Density and Systems Packaging, Denver, CO, pp. 145-152. Ohr, . Intel technologist cites power as biggest issue, EE times, Feb. 6, 2001. Pautsch, . 2001, "An Overview on the System Packaging of the CRAY SV2 Supercomputer, Proceedings of InterPACK’01, Kauai, Hawaii.
SPIE is an international technical society dedicated to advancing engineering and scientific. applications of optical, photonic, imaging, electronic, and optoelectronic technologies. K. Kołodziejak, T. Łukasiewićz, Institute of Electronic Materials Technology (Poland)
data of the paperback book PROCEEDINGS INTL INTERSOCIETY.
data of the paperback book PROCEEDINGS INTL INTERSOCIETY. Proceedings intl intersociety electronic & photonic packaging conf & exhibition: 3 vol set (IX0508).
Author : American Society of Mechanical Engineers. Publisher : American Society of Mechanical Engineers,U. R.,100 on (FREE Delivery).
SPIE, the international society for optics and photonics. ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by device makers, equipment and materials suppliers, and academics.
Proceedings of SPIE - The International Society for Optical Engineering. None Abstracts of the International Conference SPIE Defense-Security.
This page provides a list of proceedings which are due to be published in IOP Conference Series: Journal of Physics: Conference Series (JPCS). IOP Conference Series: Materials Science and Engineering (MSE). IOP Conference Series: Earth and Environmental Science (EES). The publication dates are provisional and subject to change depending on the date that the papers are submitted to IOP Conference Series.
Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures. Low Temperature and Pressureless Microfluidic Electroless Bonding Process for Vertical Interconnection. A MEMS Microphone in a FOWLP. An Assessment of Electromigration in . D Packaging.